CVE-2022-25660 (aqt1000_firmware, ar8035_firmware, qam8295p_firmware, qca6174a_firmware, qca6310_firmware, qca6335_firmware, qca6390_firmware, qca6391_firmware, qca6420_firmware, qca6421_firmware, qca6426_firmware, qca6430_firmware, qca6431_firmware, qca6436_firmware, qca6564a_firmware, qca6564au_firmware, qca6574_firmware, qca6574a_firmware, qca6574au_firmware, qca6595_firmware, qca6595au_firmware, qca6696_firmware, qca8081_firmware, qca8337_firmware, qca9377_firmware, qcm6490_firmware, qcs603_firmware, qcs605_firmware, qcs6490_firmware, qsm8350_firmware, sa6145p_firmware, sa6155_firmware, sa6155p_firmware, sa8150p_firmware, sa8155_firmware, sa8155p_firmware, sa8295p_firmware, sa8540p_firmware, sa9000p_firmware, sd_675_firmware, sd_8_gen1_5g_firmware, sd_8cx_firmware, sd_8cx_gen2_firmware, sd_8cx_gen3_firmware, sd670_firmware, sd675_firmware, sd678_firmware, sd765_firmware, sd765g_firmware, sd768g_firmware, sd778g_firmware, sd780g_firmware, sd845_firmware, sd850_firmware, sd855_firmware, sd865_5g_firmware, sd870_firmware, sd888_5g_firmware, sd888_firmware, sdx24_firmware, sdx50m_firmware, sdx55_firmware, sdx55m_firmware, sdx57m_firmware, sdx65_firmware, sdxr2_5g_firmware, sm7250p_firmware, sm7315_firmware, sm7325p_firmware, wcd9326_firmware, wcd9340_firmware, wcd9341_firmware, wcd9370_firmware, wcd9375_firmware, wcd9380_firmware, wcd9385_firmware, wcn3950_firmware, wcn3980_firmware, wcn3990_firmware, wcn3991_firmware, wcn3998_firmware, wcn6740_firmware, wcn6750_firmware, wcn6850_firmware, wcn6851_firmware, wcn6855_firmware, wcn6856_firmware, wcn7850_firmware, wcn7851_firmware, wsa8810_firmware, wsa8815_firmware, wsa8830_firmware, wsa8835_firmware)
Memory corruption due to double free issue in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile Zafiyet ile ilgili Genel Bilgi, Etki ve Çözümleri için Devamını Oku Kaynak: National Vulnerability Database