CVE-2022-33217 (sd_8_gen1_5g_firmware, wcd9380_firmware, wcn6855_firmware, wcn6856_firmware, wcn7850_firmware, wcn7851_firmware, wsa8830_firmware, wsa8835_firmware)
Memory corruption in Qualcomm IPC due to buffer copy without checking the size of input while starting communication with a compromised kernel. in Snapdragon Mobile…